Avenues

Scholarship

Pioneer

The Association of Banks in Singapore is providing the Dr Goh Keng Swee funding for the brilliant applicants at local universities in Singapore. The financial aid positions will be awarded for pursuing undergraduate studies at local universities in Singapore— National University of Singapore , Nanyang Technological University, Singapore Management University and Singapore University of Technology and Design.

Eligibility: Demonstrate leadership qualities and possess good academic and co-curricular activities (CCA) achievements; Applicants will need to present proof of language proficiency. It means applicants have to pass an official language test (for example – TOEFL or IELTS).

Benefits: Scholarship supports a maximum of four years of UG study (including Honours). It provides the following: Tuition and other compulsory fees; Airfare (to Singapore and return to home country upon completion of study), Annual maintenance allowance of SGD6500; Hostel allowance based on the institution of study; Settling-in allowance (one-off expense) of SGD200 upon arrival in Singapore.

How to apply:  Submit application at www.pscgateway.gov.sg/app/gks/account/uidsignin

Application deadline: March 15, 2020.

The University of Edinburgh invites applications for MBA scholarships for international students in the UK.

Eligibility: Details of any degrees applicants hold or expect to hold, Any relevant details from employment or training history; Details of journal articles applicants have had published; The topic of applicants proposed research; A research outline of no more than 300 words; A personal statement of no more than 300 words; Details of any other programmes or awards applicants hold or have held.

Admission requirement: Candidates must have, or expect to obtain, a UK first-class or 2:1 honours degree at undergraduate level or the international equivalent. English language requirements: All students of every nationality are required to prove their English language competence.

Application deadline: The last date to apply is March 11, 2020.